收藏本站
12. Managing Projects and Files
DSP Builder design requires the following files to store all the components:
■
■
■
■
■
■
The top-level Simulink model < top_level_name >.mdl
The import directory DSPBuilder_< top_level_name >_import and its contents.
Any source files for imported HDL.
Any Intel format hexadecimal memory initialization (. hex ) files.
Any referenced custom library files.
The analyzed Simulink model file < top_level_name >.mdlxml .
1
When you include the . mdlxml file in a Quartus II project, you do not need to call
MATLAB to synthesize the design. You can still synthesize a project without the
. mdlxml file, but you must call MATLAB as part of the generation flow.
If you do not want Quartus II synthesis to call MATLAB, or are passing the design a
user without access to MATLAB, follow one of these steps:
■
■
Include both the . mdl and corresponding . mdlxml files in the project,
Export HDL and specify the exported HDL as the source with no references to the
. mdl or . mdlxml files in the project.
1
Any design that includes HDL Import, State Machine Editor or MegaCore functions
requires the import directory.
Integration with Source Control Systems
Altera recommends that you store Quartus II archive (. qar ) files rather than
individual HDL files for source control purposes.
To create a . qar file, follow these steps in the Quartus II software:
1. Create a Quartus II project that sources the top-level Quartus II IP (. qip ) file that
the DSP Builder Export HDL flow generates ( “Exporting HDL” on page 12–3 ).
2. Perform analysis and elaboration to ensure the design incorporates any black-box
system files.
3. Archive the project by clicking Archive Project on the project menu in the
Quartus II software) to generate the . qar file.
1
Any HDL elements that you introduce into DSP Builder with custom library blocks
may require their own source control. Additional . qip files, which are referenced in
the "# Imported IP files" section of the top-level . qip file, list the required files.
November 2013
Altera Corporation
DSP Builder Handbook
Volume 2: DSP Builder Standard Blockset
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
IR11662SPBF IC CNTROL SMART RECTIFIER 8-SOIC
IR1166STRPBF IC MOSFET DRIVER N-CH 200V 8SOIC
IR11672ASPBF IC MOSFET DRIVER 200V 8-SOIC
IR1167ASTRPBF IC SMART SECONDARY DRIVER 8-SOIC
IR11682STRPBF IC MOSFET DRIVER DUAL 200V 8SOIC
IR1168SPBF IC MOSFET DRIVER DUAL 200V 8SOIC
IR1176STR IC DRIVER RECT SYNC 5V 4A 20SSOP
IR2010SPBF IC DRIVER HIGH/LOW SIDE 16SOIC
相关代理商/技术参数
IP-TRIETHERNET 功能描述:开发软件 Triple Spd Ethernet MegaCore RoHS:否 制造商:Atollic Inc. 产品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors
IP-TRIETHERNETF 功能描述:开发软件 3x Spd Ethernet MAC MegaCore RoHS:否 制造商:Atollic Inc. 产品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors
IPTV-OPTION-INS970 制造商:3M Electronic Products Division 功能描述:IPTV OPTION FOR INS970
IPU039N03L G 功能描述:MOSFET N-CH 30V 50A 3.9mOhms RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
IPU039N03LG 制造商:INFINEON 制造商全称:Infineon Technologies AG 功能描述:OptiMOS?3 Power-Transistor Features Fast switching MOSFET for SMPS
IPU039N03LGXK 制造商:Infineon Technologies AG 功能描述:Trans MOSFET N-CH 30V 50A 3-Pin(3+Tab) TO-251
IPU04N03LA 功能描述:MOSFET N-CH 25V 50A IPAK RoHS:否 类别:分离式半导体产品 >> FET - 单 系列:OptiMOS™ 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds（最大）@ Id, Vgs @ 25° C:180 毫欧 @ 9A，10V Id 时的 Vgs(th)（最大）:4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件
IPU04N03LA G 功能描述:MOSFET N-CH 25V 50A IPAK RoHS:是 类别:分离式半导体产品 >> FET - 单 系列:OptiMOS™ 标准包装:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道，金属氧化物 FET 特点:逻辑电平门 漏极至源极电压(Vdss):200V 电流 - 连续漏极(Id) @ 25° C:18A 开态Rds（最大）@ Id, Vgs @ 25° C:180 毫欧 @ 9A，10V Id 时的 Vgs(th)（最大）:4V @ 250µA 闸电荷(Qg) @ Vgs:72nC @ 10V 输入电容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安装类型:通孔 封装/外壳:TO-220-3 整包 供应商设备封装:TO-220FP 包装:管件